Get our Daily Newsletter to stay updated on education policies, research, jobs & more.
/
/
Indian Institute of Technology (IIT) Guwahati and Tata Electronics Private Limited have signed a memorandum of understanding (MoU) to expand semiconductor packaging education, technical training and research in India. The partnership will focus on preparing students for the industry requirements in the semiconductor assembly, testing, marketing and packaging (ATMP).
The agreement also includes that at the IIT Guwahati campus, a Centre of Excellence (CoE) will be established by the two organisations. The centre supports the specialised training and research on semiconductor packaging technologies, as well as expanding access to industry-oriented education in Assam and the Northeast.
The initiative will also involve students from engineering colleges, polytechnics and other educational institutions and will present opportunities for practical learning and exposure to semiconductor industry requirements.
The agreement will open the door to undergraduate (UG) and postgraduate (PG) students working together on research in the area of semiconductor packaging, assembly and testing technologies.
IIT Guwahati dean of research and development Rohit Sinha and Tata Electronics chief human resources officer Ranjan Bandyopadhyay signed the agreement at the institute’s campus on October 30.
“This initiative aims to connect academic institutions, industry and students through specialised education, practical training and collaborative research,” said Devendra Jalihal, director of IIT Guwahati, speaking about the initiative.
He also added that the partnership will broaden the access to advanced technical education and boost the regional talent by “identifying relevant institutions across Assam and supporting the development of semiconductor-focused curricula”.
Get key education news, research, and job opportunities in your inbox.